Philips Stereo Amplifier TDA1020 User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA1020  
12 W car radio power amplifier  
November 1982  
Product specification  
File under Integrated Circuits, IC01  
 
Philips Semiconductors  
Product specification  
12 W car radio power amplifier  
TDA1020  
Fig.1 Internal block diagram; the heavy lines indicate the signal paths.  
PINNING  
1. Negative supply (substrate)  
2. Output power stage  
3. Positive supply (V )  
P
4. Bootstrap  
5. Ripple rejection filter  
6. Input power stage  
7. Output preamplifier  
8. Input preamplifier  
9. Negative supply  
November 1982  
3
Preliminary Specification  
 
Philips Semiconductors  
Product specification  
12 W car radio power amplifier  
TDA1020  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
Supply voltage; operating (pin 3)  
Supply voltage; non-operating  
V
V
V
max.  
max.  
max.  
max.  
18 V  
28 V  
45 V  
6 A  
P
P
Supply voltage; load dump  
P
Non-repetitive peak output current  
Total power dissipation  
I
OSM  
see derating curves Fig.2  
Storage temperature range  
T
55 to + 150 °C  
stg  
Crystal temperature  
T
max.  
max.  
150 °C  
c
Short-circuit duration of load behind output electrolytic capacitor  
at 1 kHz sine-wave overdrive (10 dB); V = 14,4 V  
t
100 hours  
sc  
Fig.2 Power derating curves.  
November 1982  
4
Preliminary Specification  
 
Philips Semiconductors  
Product specification  
12 W car radio power amplifier  
TDA1020  
HEATSINK DESIGN EXAMPLE  
The derating of 8 K/W of the encapsulation requires the following external heatsink (for sine-wave drive):  
10 W in 2 at V = 14,4 V  
P
maximum sine-wave dissipation: 5,2 W  
T
= 60 °C maximum  
amb  
150 60  
----------------------  
5, 2  
Rth j-a = Rth j-tab + Rth tab-h + Rth h-a  
Since R + R = 8 K/W, R  
=
= 17,3 K/W  
= 17,3 8 9 K/W.  
th j-tab  
th tab-h  
th h-a  
D.C. CHARACTERISTICS  
Supply voltage range (pin 3)  
Repetitive peak output current  
Total quiescent current  
V
6 to 18 V  
4 A  
P
I
<
ORM  
at V = 14,4 V  
I
I
typ.  
typ.  
30 mA  
P
tot  
at V = 18 V  
40 mA  
P
tot  
A.C. CHARACTERISTICS  
T
= 25 °C; V = 14,4 V; R = 4 ; f = 1 kHz; unless otherwise specified; see also Fig.3  
amb  
P
L
Output power at d = 10%; with bootstrap (note 1)  
tot  
>
10 W  
12 W  
6 W  
V = 14,4 V; R = 2 Ω  
P
P
L
o
typ.  
>
V = 14,4 V; R = 4 Ω  
P
P
P
L
o
typ.  
typ.  
7 W  
V = 14,4 V; R = 8 Ω  
3,5 W  
P
L
o
Output power at d = 1%; with bootstrap (note 1)  
tot  
V = 14,4 V; R = 2 Ω  
P
P
P
typ.  
typ.  
typ.  
9,5 W  
6 W  
P
L
o
o
o
V = 14,4 V; R = 4 Ω  
P
L
V = 14,4 V; R = 8 Ω  
3 W  
P
L
Output voltage (r.m.s. value)  
R = 1 k; d = 0,5%  
V
P
typ.  
>
5 V  
L
tot  
o(rms)  
Output power at d = 10%; without bootstrap  
4,5 W  
tot  
o
Voltage gain  
typ.  
typ.  
typ.  
17,7 dB  
16,7 to 18,7 dB  
29,5 dB  
preamplifier (note 2)  
G
G
G
v1  
power amplifier  
total amplifier  
v2  
28,5 to 30,5 dB  
47 dB  
v tot  
46,2 to 48,2 dB  
November 1982  
5
Preliminary Specification  
 
Philips Semiconductors  
Product specification  
12 W car radio power amplifier  
TDA1020  
Input impedance  
preamplifier  
typ.  
typ.  
40 kΩ  
28 to 52 kΩ  
40 kΩ  
|Z |  
i
power amplifier  
Output impedance  
preamplifier  
|Z |  
i
28 to 52 kΩ  
typ.  
typ.  
2,0 kΩ  
1,4 to 2,6 kΩ  
50 mΩ  
|Z |  
o
power amplifier  
|Z |  
o
Output voltage (r.m.s. value) at d = 1%  
tot  
>
1 V  
1,5 V  
preamplifier (note 2)  
V
B
o(rms)  
typ.  
Frequency response  
50 Hz to 25 kHz  
Noise output voltage (r.m.s. value; note 3)  
typ.  
<
0,3 mV  
0,5 mV  
0,5 mV  
1,0 mV  
R = 0 Ω  
V
V
S
n(rms)  
typ.  
<
R = 8,2 kΩ  
S
n(rms)  
Ripple rejection (note 4)  
at f = 100 Hz; C2 = 1 µF  
RR  
RR  
typ.  
>
44 dB  
48 dB  
54 dB  
at f = 1 kHz to 10 kHz  
typ.  
Bootstrap current at onset of clipping (pin 4)  
R = 4 and 2 Ω  
Stand-by current (note 5)  
I
typ.  
<
40 mA  
1 mA  
L
4
I
sb  
Crystal temperature for 3 dB gain  
T
>
150 °C  
c
Notes  
1. Measured with an ideal coupling capacitor to the speaker load.  
2. Measured with a load resistor of 40 kΩ.  
3. Measured according to IEC curve-A.  
4. Maximum ripple amplitude is 2 V; input is short-circuited.  
5. Total current when disconnecting pin 5 or short-circuited to ground (pin 9).  
6. The tab must be electrically floating or connected to the substrate (pin 9).  
November 1982  
6
Preliminary Specification  
 
Philips Semiconductors  
Product specification  
12 W car radio power amplifier  
TDA1020  
(1) With R = 2 , preferred value of C8 = 2200 µF.  
L
Fig.3 Test circuit.  
November 1982  
7
Preliminary Specification  
 
Philips Semiconductors  
Product specification  
12 W car radio power amplifier  
TDA1020  
PACKAGE OUTLINE  
SIL9MPF: plastic single in-line medium power package with fin; 9 leads  
SOT110-1  
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index  
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
Z
max.  
A
max.  
2
(1)  
(1)  
E
UNIT  
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5  
17.8  
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48  
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20  
3.9 2.75 3.4 1.75 15.1  
3.4 2.50 3.2 1.55 14.9  
4.4  
4.2  
5.9  
5.7  
2.54  
mm  
3.7  
0.25 1.0  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-02-25  
SOT110-1  
November 1982  
8
Preliminary Specification  
 
Philips Semiconductors  
Product specification  
12 W car radio power amplifier  
TDA1020  
SOLDERING  
Introduction  
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and  
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for  
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often  
used.  
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our  
“IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the  
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.  
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the  
specified maximum storage temperature (T  
). If the printed-circuit board has been pre-heated, forced cooling may  
stg max  
be necessary immediately after soldering to keep the temperature within the permissible limit.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more  
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to  
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
November 1982  
9
Preliminary Specification  
 

Peavey Musical Instrument Amplifier 6505 MH User Manual
Philips CRT Television 14CE1201 User Manual
Philips Microcassette Recorder LFH0620 User Manual
Pioneer Home Theater System 53SBX59B User Manual
Pioneer Stereo Receiver VSX 9130TXH K User Manual
Poulan Trimmer 530086997 User Manual
Powermatic Saw PWBS 14 User Manual
Precor Elliptical Trainer EFX 521 User Manual
Premier Mounts Indoor Furnishings PSD CAM User Manual
PYLE Audio DJ Equipment PYD2400U User Manual